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Industry Focus: Exploring the New Future of UV Curing Everay invites you to the "6th Radiation Curing Adhesive & Debonding Technology Innovation Forum" on March 23 in Shanghai.
Release time:
2026-03-21
Event Preview: Focusing on High-End Electronics & Advanced Manufacturing
As a professional manufacturer in the field of photocuring resins, Everay closely monitors the latest global shifts in radiation curing technology. We are honored to announce that the highly anticipated "2026 (6th) Radiation Curing Adhesive & Debonding Technology Innovation Forum" will grandly open on March 23, 2026, in Shanghai, China.
Co-organized by Adhesion Information and the New Materials Industry Alliance, and held concurrently with the Munich Shanghai Electronic Production Equipment Exhibition (productronica China), this forum arrives at a critical time. Against the backdrop of accelerated semiconductor localization, the rise of the "low-altitude economy," and the intelligent upgrading of automotive electronics, the event will gather leaders from the industry chain—including BASF, Sanmu Group, Huitian New Materials, and Siruida—along with experts from research institutes. Together, they will discuss breakthroughs and innovations in UV/EB curing technologies for high-end applications.
Core Topics: Expert Insights & Technological Trends
Keeping a finger on the pulse of the industry, the forum features confirmed reports that will guide the application of photocuring resins:
Formulation Breakthroughs in UV Debonding Adhesives: Targeting high-end applications like semiconductor wafer dicing, experts from the Harbin Institute of Technology (Wuxi Research Institute) will deeply analyze formulation design logic. They will explore how to balance high bonding strength with the technical challenge of rapid debonding upon light exposure.
Practical Implementation of EB Curing: Companies like Jiangsu Zhiyan Technology will share the latest practices in Electron Beam (EB) curing for adhesives, offering new ideas for applications demanding deeper curing and lower odor.
Material Opportunities in Emerging Fields: While the "Low-Altitude Economy, Robotics, and Automotive Electronics" are focal points of concurrent forums, their urgent demand for lightweight, high-strength, and weather-resistant adhesive materials opens a massive incremental market for radiation curing resins (such as novel acrylates and epoxy-modified resins).
Everay: Building on Quality, Your Reliable Resin Partner
In the field of photocuring resins, Everay firmly believes that stable raw materials are the cornerstone of high-end adhesive innovation. While industry applications evolve daily, our commitment to the quality of our core products remains unchanged.
Addressing the semiconductor, electronics, and advanced manufacturing sectors highlighted in this forum, we do not blindly chase concepts. Instead, relying on years of accumulated production processes and quality control systems, we provide adhesive manufacturers with:
High-Stability Standard Series: Our standard acrylates and epoxy-modified resins feature minimal batch-to-batch variation. This ensures high reproducibility in your formulations and significantly reduces quality inspection risks for end-users.
Flexible Customization: Facing new demands raised at the forum (such as lower viscosity, higher functionality, or special weatherability), our R&D team possesses the capability for rapid prototyping and adjustment, serving as a solid backing for your new product development.
Competitive Supply Chain Security: Leveraging our mature capacity layout, we promise to provide stable and timely supply to our partners even amidst market fluctuations, ensuring your worry-free delivery.
We look forward to participating in this industry event, listening to technical insights from leaders like BASF and Sanmu Group, and integrating these cutting-edge concepts into our future product iterations to empower our customers' innovations with superior basic resins.
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